Accession Number:

ADA056076

Title:

The Effects of Substrate Composition on Thick Film Circuit Reliability.

Descriptive Note:

Quarterly rept. no. 1, 1 Feb-30 Apr 78,

Corporate Author:

PURDUE RESEARCH FOUNDATION LAFAYETTE IND

Personal Author(s):

• Vest,R. W.

Report Date:

1978-05-30

Pagination or Media Count:

24.0

Abstract:

Thick film resistors were prepared with and without AlSiMag 614 substrate dissolved in the resistor glass. The electrical characteristics of these devices were studied during sinteranneal cycles up to 525 C. Two effects were identified, one which results in a slow decrease in resistance with time at the lower anneal temperatures and another which results in a more rapid increase in resistance at the higher anneal temperatures. The mechanisms of these effects are discussed in terms of changes in glass composition resulting from resistor - substrate interactions. Author

Descriptors:

• *SUBSTRATES
• *CERAMIC MATERIALS
• *THICK FILMS
• *RESISTORS
• TEMPERATURE
• ANNEALING
• ALUMINUM COMPOUNDS
• INTERACTIONS
• FABRICATION
• ELECTRICAL RESISTANCE
• MAGNESIUM COMPOUNDS
• SILICON COMPOUNDS
• COMPOSITION(PROPERTY)
• SINTERING

Subject Categories:

• Electrical and Electronic Equipment
• Ceramics, Refractories and Glass

Distribution Statement:

APPROVED FOR PUBLIC RELEASE