Hybrid Microcircuit Failure Rate Prediction
Final technical rept. Aug 1976-Feb 1977
IIT RESEARCH INST CHICAGO IL RELIABILITY ANALYSIS CENTER
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This report presents an updated reliability prediction model for hybrid microcircuits for inclusion in MIL-HDBK-217B, Reliability Prediction of Electronic Equipment. The new model differs in several ways from the previous MIL-HDBK-217B prediction technique. Some of the changes include the addition of a density factor and an interconnection factor changes in the package factor and quality factor and individual assessments of the effect of temperature and environment on the elements of the hybrid microcircuits. Comparisons are presented comparing the predicted failure rates to the failure rate experienced by various hybrid microcircuits in the field. Also, the relative contributions of the terms in the model are compared to the distribution of field failure causes.
- Electrical and Electronic Equipment
- Manufacturing and Industrial Engineering and Control of Production Systems