Impact Stresses in Wire and Wire Bonds: Upper Limit Analysis
Final technical rept.
SYRACUSE UNIV NY DEPT OF MECHANICAL AND AEROSPACE ENGINEERING
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An analysis is made of the stresses produced on a wire bond within a rectangular flat-pack during a flatwise upside-down impact on a rigid floor. The formulas developed imply rather significant wire stresses and bond forces.
- Electrical and Electronic Equipment
- Fabrication Metallurgy