Thermal Characteristics of Hybrid Circuits.
ARMY MISSILE RESEARCH AND DEVELOPMENT COMMAND REDSTONE ARSENAL AL ADVANCED S YSTEMS DEV/MFG TECH DIRECTORATE
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This report presents an evaluation of thermal resistance in hybrid microelectronics. Four different package types were used with an without multiple layer thick circuitry. Chip components were attached using both epoxy and eutectic methods. Author
- Electrical and Electronic Equipment