Accession Number:

ADA053009

Title:

Thermal Characteristics of Hybrid Circuits.

Descriptive Note:

Technical rept.,

Corporate Author:

ARMY MISSILE RESEARCH AND DEVELOPMENT COMMAND REDSTONE ARSENAL AL ADVANCED S YSTEMS DEV/MFG TECH DIRECTORATE

Report Date:

1977-05-12

Pagination or Media Count:

80.0

Abstract:

This report presents an evaluation of thermal resistance in hybrid microelectronics. Four different package types were used with an without multiple layer thick circuitry. Chip components were attached using both epoxy and eutectic methods. Author

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE