QA Procedures for Complex Microcircuits.
Final technical rept. Jul 76-Jul 77,
HARRIS CORP MELBOURNE FLA ELECTRONIC SYSTEMS DIV
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The purpose of this study was to establish an alternate procedure in lieu of High Magnification preseal visual for complex microcircuits. In-line wafer process controls were developed which provide effective control of the wafer visual conditions. Changes to MIL-STD-883 have been recommended to implement this process control. The study approach was to perform wafer mapping of visual defect locations develop in-line wafer process controls from this data perform preliminary testing with known visual defects on LSI chips to verify alternate test methods and perform final verification testing on complex LSI wafer product processed in accordance with the recommended procedures. In addition, it was found that a package problem generated numerous bond failures which were not adequately detected by 10 temperature cycles. A change has been recommended to MIL-STD-883 to perform 100 cycles of temperature cycling. Author
- Electrical and Electronic Equipment
- Manufacturing and Industrial Engineering and Control of Production Systems