Accession Number:

ADA050875

Title:

Investigation of Factors Involved in Reliability Assurance of Plastic-Encapsulated Integrated Circuits.

Descriptive Note:

Final rept. 1 Nov 76-1 Nov 77,

Corporate Author:

CLEMSON UNIV SC DEPT OF ELECTRICAL AND COMPUTER ENGINEERING

Personal Author(s):

Report Date:

1978-02-08

Pagination or Media Count:

44.0

Abstract:

Upper temperature limits to accelerated stress testing of plastic-encapsulated integrated circuits were determined and evidence of chip-encapsulant interaction was obtained. Possible yield-reliability correlations were considered and alternatives to MIL-M-38510 screening were discussed for plastic-encapsulated ICs. Author

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE