Investigation of Factors Involved in Reliability Assurance of Plastic-Encapsulated Integrated Circuits.
Final rept. 1 Nov 76-1 Nov 77,
CLEMSON UNIV SC DEPT OF ELECTRICAL AND COMPUTER ENGINEERING
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Upper temperature limits to accelerated stress testing of plastic-encapsulated integrated circuits were determined and evidence of chip-encapsulant interaction was obtained. Possible yield-reliability correlations were considered and alternatives to MIL-M-38510 screening were discussed for plastic-encapsulated ICs. Author
- Electrical and Electronic Equipment