Accession Number:

ADA048890

Title:

The Effects of Substrate Composition on Thick Film Circuit Reliability.

Descriptive Note:

Quarterly rept. no. 3, 1 Aug 77-31 Oct 77,

Corporate Author:

PURDUE RESEARCH FOUNDATION LAFAYETTE IND

Personal Author(s):

Report Date:

1977-11-30

Pagination or Media Count:

28.0

Abstract:

The initial stage sintering kinetics for lead borosilicate glasses were studied in order to determine the effect of substrate dissolution in the glass on the surface tension to viscosity ratio. Substrate additions up to 10 weight percent decreased the magnitude of this ratio by a factor of 10 but left its temperature dependence unchanged. Thick film resistors were fabricated with and without substrate dissolved in the resistor glass, and differences up to a factor of 100 were found in both the magnitude and temperature dependence of the sheet resistance. Author

Subject Categories:

  • Electrical and Electronic Equipment
  • Solid State Physics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE