Accession Number:

ADA048618

Title:

Basic Adhesion Mechanisms in Thick and Thin Films.

Descriptive Note:

Quarterly rept. no. 3, 1 Jul-30 Sep 77,

Corporate Author:

RCA LABS PRINCETON N J

Personal Author(s):

Report Date:

1977-11-01

Pagination or Media Count:

34.0

Abstract:

In the study of frit-bonded materials this quarter, the sintering of gold powders was studied and indicated to be assisted by the presence of a lead borosilicate glass in the second stage of sintering solution-precipitation at higher temperatures. The evolution of organic-vehicle-burnoff gas products from sintering gold and goldglass powders was also investigated. For the materials studied, which were typical of thick-film paste constituents, it was concluded that organic burnout should not interfere with the sintering of most gold powders. It was further determined that at the completion of burnout, the organic burnoff gases should be able to escape through the glass phase rapidly enough to prevent their entrapment in the partially sintered structure.

Subject Categories:

  • Ceramics, Refractories and Glass
  • Metallurgy and Metallography
  • Fabrication Metallurgy

Distribution Statement:

APPROVED FOR PUBLIC RELEASE