Modular Packaging Approaches.
Final rept. 1 Mar-30 Sep 76,
WESTINGHOUSE ELECTRIC CORP BALTIMORE MD
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The objective of this study is to investigate the feasibility, practicality, and implementation of standard electronic modules SEM for avionics. Tradeoff studies are used to provide quantitative SEM formats. The broad spectrum of considerations necessary to characterize standard packaging for a wide class of avionics applications are investigated. In depth quantification is placed primarily on digital signal processing and to a lesser degree on analog circuitry. The work is performed in four tasks whereby Task I evaluates current and past industry and DOD module programs, Task II studies present technology and technological trends for determination of the standard avionics modules, Task III is a compilation of industry and DOD data concerning standard module information and concepts, and Task IV is the detailed development and evaluation of the proposed Westinghouse SEM including the construction of demonstration hardware. The efforts of Tasks I, II, and III are described in the previous issued interim Report AFAL-TR-76-61, Volume 1. This Final Report describes the details of the study performed on Task IV with the conclusions made and recommendations for future work. Author
- Electrical and Electronic Equipment
- Containers and Packaging