Development of Improved Solders for Electronic Reliability.
Final rept. 15 Mar 76-12 Apr 77,
HUGHES AIRCRAFT CO FULLERTON CALIF GROUND SYSTEMS GROUP
Pagination or Media Count:
A higher temperature solder alloy intended for use on polyimide printed wiring boards was developed. The solder shows no evidence of cracking after exposure to 500 temperature cycles between 200 C and -55 C. A comparative test with Sn63 between 125 C and -55 C resulted in cracking after 200 cycles. The alloy 90Pb9Cd1Zn was the result of selecting, testng and modifying all possible alloy systems that would be suitable for printed wiring board application. The resulting alloy, in addition to providing increased reliability, offers a significant cost reduction over the conventional tin-lead system.
- Properties of Metals and Alloys
- Fabrication Metallurgy