Accession Number:

ADA045089

Title:

High-Reliability, Low-Cost Integrated Circuits.

Descriptive Note:

Quarterly development rept. no. 6, 3 May-3 Aug 77.

Corporate Author:

RCA SOLID STATE TECHNOLOGY CENTER SOMERVILLE N J

Personal Author(s):

Report Date:

1977-08-03

Pagination or Media Count:

25.0

Abstract:

Wafer fabrication is proceeding as scheduled. The technology development for platimum sputter etching using gold as the etch mask has progressed sufficiently to allow conversion of the COSMOS circuits to sputter etching. Reliability data to date obtained on CA741 devices shows a 0.0044 per 1000 hours failure rate at 120 C at the 60-percent confidence level. Copper migration in epoxy packages at 125 C has not been observed as a failure mode. Salt atmosphere resistance tests to date have produced excellent results. All required life-test sockets for Phase II and some of the sockets for Phase III of the program have been ordered.

Subject Categories:

  • Electrical and Electronic Equipment
  • Ceramics, Refractories and Glass
  • Fabrication Metallurgy
  • Plastics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE