Accession Number:

ADA034852

Title:

The Dynamic Measurement and Functional Inspection of Solder Joints.

Descriptive Note:

Final rept. on Phase 1.

Corporate Author:

LOCKHEED ELECTRONICS CO INC PLAINFIELD N J

Personal Author(s):

Report Date:

1976-12-15

Pagination or Media Count:

169.0

Abstract:

The study evaluated the effectiveness of nondestructive and dynamic measurement techniques for determining the quality and reliability of solder joints when compared to the presently used method of visually inspecting solder joints for cosmetic appearance. The study concludes that inspection cost can be reduced and the reliability of solder joints can be best assured by quantitatively controlling soldering processes.

Subject Categories:

  • Electrical and Electronic Equipment
  • Couplers, Fasteners and Joints
  • Manufacturing and Industrial Engineering and Control of Production Systems

Distribution Statement:

APPROVED FOR PUBLIC RELEASE