The Dynamic Measurement and Functional Inspection of Solder Joints.
Final rept. on Phase 1.
LOCKHEED ELECTRONICS CO INC PLAINFIELD N J
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The study evaluated the effectiveness of nondestructive and dynamic measurement techniques for determining the quality and reliability of solder joints when compared to the presently used method of visually inspecting solder joints for cosmetic appearance. The study concludes that inspection cost can be reduced and the reliability of solder joints can be best assured by quantitatively controlling soldering processes.
- Electrical and Electronic Equipment
- Couplers, Fasteners and Joints
- Manufacturing and Industrial Engineering and Control of Production Systems