Development of a Model for the Ultrasonic Wire Bond Used in Microcircuit Fabrication.
DREXEL UNIV PHILADELPHIA PA DEPT OF ELECTRICAL ENGINEERING
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The primary objective of this contract has been to develop and improve the experimental techniques needed to evaluate the microcircuit bond model. To this end an alternate technique has been developed for separating the bond so that the interface can be examined techniques and equipment for fabricating substrates have been improved methods for measuring substrate properties have been developed techniques for making several thousands of bonds to each substrate have been developed and methods for controlling ball size and shape have been developed. The techniques and equipments required for a full scale study of the microcircuit bond model are now available. The initial results indicate that the bond model is reasonably consistent with the test results. A full scale study of the bond model is recommended.
- Electrical and Electronic Equipment
- Manufacturing and Industrial Engineering and Control of Production Systems