Accession Number:

ADA031162

Title:

Particulate Silicone Rubber: An Effective, Removable Encapsulant for Electronic Packaging.

Descriptive Note:

Technical rept.,

Corporate Author:

HARRY DIAMOND LABS ADELPHI MD

Report Date:

1976-08-01

Pagination or Media Count:

17.0

Abstract:

A method of encapsulating electronic circuit board assemblies that enables rapid application and removal of the encapsulant was developed and evaluated. Low-density, inexpensive, foamed silicone rubber particles that are environmentally and electrically stable were used in lieu of conventional hard potting. The silicone rubber particles can be easily applied by pouring and packing into electronic package voids they are likewise easily removed from the package and reusable, should circuit maintenance of rework be necessary. Vibration tests of typical missile-borne applications indicate that, at resonance, electronic-circuit-board assemblies protected by this method experiences less than 10 percent of the acceleration measured before encapsulation. Author

Subject Categories:

  • Electrical and Electronic Equipment
  • Plastics
  • Elastomers and Rubber

Distribution Statement:

APPROVED FOR PUBLIC RELEASE