Reliability Evaluation of ECL Microcircuits.
Final rept. May 74-May 76,
RAYTHEON CO BEDFORD MASS MISSILE SYSTEMS DIV
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The objective of this study was to undertake a detailed analysis and reliability evaluation of ECL microcircuits available for use in high speed digital circuits. Special emphasis was placed on the effects of electromigration. The selected devices included SSI and MSI integration, one and two level metallization from a total of four major vendors. Metallization included aluminum with a silicon dopant, aluminum with copper and silicon dopants and pure aluminum with a titanium-tungsten barrier. Detail construction analysis and electrical characterization including thermal resistances were performed on all devices. Devices which failed during the performance of life testing were electrically categorized and physically analyzed to establish failure modes and mechanisms.
- Electrical and Electronic Equipment
- Manufacturing and Industrial Engineering and Control of Production Systems