Manufacturing Methods and Technology Program for Beam Lead Sealed Junction Semiconductor Devices.
Quarterly progress rept. no. 4, 21 Feb-21 May 76,
MOTOROLA INC PHOENIX ARIZ SEMICONDUCTOR PRODUCTS DIV
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The object of this study is to refine the processes required to fabricate beam-lead sealed junction devices in production quantities by manufacturing methods. The quarter has seen major advances in minority lifetime control, control of surface leakage, photo masking techniques, and control of surface states.
- Electrical and Electronic Equipment
- Manufacturing and Industrial Engineering and Control of Production Systems