Accession Number:

ADA028880

Title:

Basic Adhesion Mechanisms in Thick and Thin Films.

Descriptive Note:

Quarterly rept. no. 2, 1 Apr-30 Jun 76,

Corporate Author:

RCA LABS PRINCETON N J

Personal Author(s):

Report Date:

1976-07-30

Pagination or Media Count:

36.0

Abstract:

Work on the fundamental wetting and sintering processes was continued, so that comparisons could be made among Au, Ag, Cu, Pt, and Pd. Metal powder sintering rate studies in the presence and absence of E1527 glass were completed for Pt and Pd and showed no increase in densification with glass present. Only Ag densification is enhanced in the presence of glass, while Pt, Pd, Cu and Au experience some retrograde sintering swelling. Electrical resistivity ratios, R300 KR77 K, were determined for layered Au metallization on alumina, glaze, and CuO-doped glaze surfaces after firing at 500, 750, and 900C. Similar resistivity ratio tests were performed on layered 75 Au-25 Pt wt pct metallization to determine the degree of alloying as a function of firing temperature. The x-ray fluorescence spectrometric XRFS analysis of 21 commercial Au-Pt and Au-Pt-Pd fired conductor films were completed.

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE