Accession Number:

ADA027520

Title:

Modular Packaging Approaches. Volume I.

Descriptive Note:

Interim rept. 1 Jun-30 Nov 75,

Corporate Author:

WESTINGHOUSE ELECTRIC CORP BALTIMORE MD

Personal Author(s):

• Staley, W. W.

Report Date:

1976-06-01

Pagination or Media Count:

101.0

Abstract:

The objective of the study is to investigate the feasibility, practicality, and implementation of standard electronic modules SEM for avionics. Tradeoff studies are used to provide quantitative data to assist the Air Force Engineers in selecting the SEM formats. The broad spectrum of considerations necessary to characterize standard packaging for a wide class of avionics applications are investigated. In depth quantification is placed primarily on digital signal processing and to a lesser degree on analog circuitry. The work is performed in three tasks whereby Task I evaluates current and past industry and DOD module programs, Task II studies present technology and technology trends for determination of the standard avionics modules, and Task III is a compilation of industry and DOD data concerning standard module information and concepts. The report describes the details of the study with conclusions made and recommendations for future work to be considered.

Descriptors:

• *AVIONICS
• *MODULES(ELECTRONICS)
• PACKAGING
• STANDARDIZATION
• TRADE OFF ANALYSIS

Subject Categories:

• Flight Control and Instrumentation

Distribution Statement:

APPROVED FOR PUBLIC RELEASE