Manufacturing Methods and Technology Program for Beam Lead Sealed Junction Semiconductor Devices.
Quarterly progress rept. no. 3, 21 Nov 75-21 Feb 76,
MOTOROLA INC PHOENIX ARIZ SEMICONDUCTOR PRODUCTS DIV
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The object of the study is to refine the processes required to fabricate beam-lead sealed junction devices in production quantities by manufacturing methods. Considerable progress was made during the third quarter of the program. A number of different types of discretes and integrated circuits were delivered. Some of the past problems have been resolved, but the real challenge is still the discretes with their differing processing profiles. This report reviews the activities along with the present status of most of the devices. The tri-metallization process is reviewed in detail.
- Electrical and Electronic Equipment
- Manufacturing and Industrial Engineering and Control of Production Systems