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High Reliability, Low Cost Integrated Circuits.
Quarterly development rept. no. 1, 3 Feb-3 May 76.
RCA SOLID STATE TECHNOLOGY CENTER SOMERVILLE N J
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The photomasks required for the fabrication of parts were designed. Modifications to the standard design rules were made to eliminate potential reliability hazards, and critical-process-step evaluations initiated. Wafer fabrication was initiated on five of the integrated circuit types. Process techniques were developed to plate 1.0 mil-high gold bonding bumps to facilitate the automated assembly process. Investigation of the beam tape structure showed that unplated tape may be successfully bonded to gold bumps without compromising reliability. This represents a potential major cost reduction. Life-test circuits for three integrated circuit types were designed and ordered.
APPROVED FOR PUBLIC RELEASE