Large Package Hybrid Qualification Tests.
Final technical rept. Feb 73-Jun 74,
HUGHES AIRCRAFT CO FULLERTON CALIF SYSTEMS EFFECTIVENESS DEPT
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This report presents the results of a study to determine the capability of large Hybrid packages to withstand the MIL-STD-883, Test Methods and Procedures for Microelectronics, environmental tests recommended for monolithic ICs, and to develop an updated prediction model for large Hybrid packages for inclusion in MIL-HDBK-217B. It was found that the ability to pass various environmental tests varied widely from package to package but generally, suitable stress levels from MIL-STD-883 were found for each package type. An updated prediction model was developed. In so doing the complexity curves were modified, new examples given and the use of the heat sink temperature versus temperature factor curve clarified. Finally, a simplified prediction model was developed. Author
- Electrical and Electronic Equipment