Accession Number:

ADA023846

Title:

Manufacturing Methods and Technology Program for Beam Lead Sealed Junction Semiconductor Devices.

Descriptive Note:

Quarterly progress rept. no. 2, 21 Aug-21 Nov 75,

Corporate Author:

MOTOROLA INC PHOENIX ARIZ SEMICONDUCTOR PRODUCTS DIV

Report Date:

1975-11-21

Pagination or Media Count:

83.0

Abstract:

The object of the study is to refine the processes required to fabricate beam-lead sealed junction devices in production quantities by manufacturing methods. A detailed evaluation is included on most devices not discussed in the First Quarterly Report. The status of all devices presently in design or processing is reviewed.

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE