Manufacturing Methods and Technology Program for Beam Lead Sealed Junction Semiconductor Devices.
Quarterly progress rept. no. 2, 21 Aug-21 Nov 75,
MOTOROLA INC PHOENIX ARIZ SEMICONDUCTOR PRODUCTS DIV
Pagination or Media Count:
The object of the study is to refine the processes required to fabricate beam-lead sealed junction devices in production quantities by manufacturing methods. A detailed evaluation is included on most devices not discussed in the First Quarterly Report. The status of all devices presently in design or processing is reviewed.
- Electrical and Electronic Equipment