Basic Adhesion Mechanisms in Thick and Thin Films.
Final rept. 1 Jan-31 Dec 75,
RCA LABS PRINCETON N J
Pagination or Media Count:
A study of adhesion mechanism in silver, copper and gold conductors and thick film conductor ink constituents is presented. Data on the sintering rates of the characterized gold, silver and copper powders are compared with similar data taken after adding a typical glass frit to the metal. Glass wetting rates were measured on substrates of gold, silver, copper and alumina, and the effects of adding copper oxide to the glass were noted. Layeredstructure conductors were produced by screening and firing the glass phase layer before the metal phase layer. In other experiments a metal foil was laminated to the glass layer. In the case of copper, adhesion strength improved when the metallization was fired in a slightly oxidizing atmoshere. These data are discussed in terms of the theoretical behavior of ink materials, and their properties are compared with those of 13 silver and 4 copper commercial thick-film conductors. Chemical and physical analytical data are presented for the commercial inks. In both the model ink and the commercial ink studies, the chemical activity of the metal on which the inks were based was found to have a significant effect on ink properties. Adhseion was generally significantly higher for silver-based inks than for gold-based inks despite the fact that a smaller volume fraction of binder was found in silver than in gold inks.
- Polymer Chemistry