Accession Number:

ADA022256

Title:

Thermal Analysis Considerations of Hybrid Microelectronic Circuits.

Descriptive Note:

Technical rept.,

Corporate Author:

ARMY MISSILE RESEARCH DEVELOPMENT AND ENGINEERING LAB REDSTONE ARSENAL ALA GUIDANCE AND CONTROL DIRECTORATE

Personal Author(s):

Report Date:

1975-09-01

Pagination or Media Count:

68.0

Abstract:

This report presents the results of an analytical study of heat flow in hybrid microelectronic circuits and packages. The study is divided in two parts. First, heat removal from the package by convection and radiation is considered. Second, conduction of heat from an active chip area to a heat-sinked package header is modeled by use of finite-difference methods. Typical examples are worked to illustrate the analytical approach, and computer results of the finite-difference method are presented. Author

Subject Categories:

  • Electrical and Electronic Equipment
  • Thermodynamics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE