Accession Number:

ADA021322

Title:

Manufacturing Methods and Technology Program for Beam Lead Sealed Junction Semiconductor Devices.

Descriptive Note:

Quarterly progress rept. no. 1, 21 May-21 Aug 75,

Corporate Author:

MOTOROLA INC PHOENIX ARIZ SEMICONDUCTOR PRODUCTS DIV

Personal Author(s):

• Peltier,Art
• Crabtree,Mike
• Zobel,Dan

Report Date:

1975-08-01

Pagination or Media Count:

52.0

Abstract:

The accomplishments of the first quarter in Motorolas effort on the USA ECOM Manufacturing Methods and Technology beam lead device program are presented herein. Much effort has been expended in evaluating each device to determine the best approach for meeting the yield and production goals of the program. On many devices this effort is completed and reported in detail. Other devices are presented in outline form because the evaluation is not complete enough for full reporting, even though much time and effort is being expended on them. Author

Descriptors:

• *INTEGRATED CIRCUITS
• *TRANSISTORS
• *BEAM LEADS
• PRODUCTION
• YIELD
• FLIP FLOP CIRCUITS
• JUNCTIONS
• SCHOTTKY BARRIER DEVICES
• NAND GATES
• SHIFT REGISTERS

Subject Categories:

• Electrical and Electronic Equipment
• Solid State Physics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE