Accession Number:

ADA021137

Title:

Orienting Silicon Integrated Circuit Chips for Lead Bonding,

Descriptive Note:

Berthold K. P. /Horn

Corporate Author:

MASSACHUSETTS INST OF TECH CAMBRIDGE ARTIFICIAL INTELLIGENCE LAB

Personal Author(s):

Report Date:

1975-01-01

Pagination or Media Count:

20.0

Abstract:

Will computers that see and understand what they see revolutionize industry by automating the part orientation and part inspection processes. There are two obstacles the expense of computing and our feeble understanding of images. The author believes these obstacles are fast ending. To illustrate what can be done he describes a working program that visually determines the position and orientation of silicon chips used in Integrated Circuits.

Descriptors:

• *AUTOMATION
• IMAGE PROCESSING
• ORIENTATION(DIRECTION)
• CHIPS(ELECTRONICS)
• INTEGRATED CIRCUITS
• SILICON
• COMPUTER APPLICATIONS

Subject Categories:

• Manufacturing and Industrial Engineering and Control of Production Systems

Distribution Statement:

APPROVED FOR PUBLIC RELEASE