Thermal Analysis of the RFSS Switch Driver.
ARMY MISSILE RESEARCH DEVELOPMENT AND ENGINEERING LAB REDSTONE ARSENAL ALA GUIDANCE AND CONTROL DIRECTORATE
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Overheated microelectronic circuits caused some equipment failures in a device known as the RFSS switch driver. A thermal analysis was made of this equipment using the CINDA computer code, and the mathematical model was validated by thermocouple readings. The effect of package material and the effect of convective cooling fins were calculated and the results are presented in graphic form. Recommendations are made for improving the dissipation of heat.
- Electrical and Electronic Equipment