Accession Number:

ADA017788

Title:

Basic Adhesion Mechanisms in Thick and Thin Films.

Descriptive Note:

Quarterly technical rept. no. 3, 7 Jan-30 Sep 75,

Corporate Author:

RCA LABS PRINCETON N J

Personal Author(s):

• Bube,Kenneth R.
• Hitch,Thomas T.

Report Date:

1975-10-31

Pagination or Media Count:

29.0

Abstract:

During this quarter, the adhesion strengths between preglazed ceramic substrates and metal foils of gold, silver, and copper were measured. In addition, the adhesion strengths of gold and silver model inks were determined using a two-level method of application, i.e., sequential depositions of glass and metal inks with a preglazing step prior to firing the metal deposit. By comparing the total sintered metal adhesion strength with the chemically derived strength from the foil-glaze measurements, it was possible to ascertain the microstructural contribution. Variations in surface bondability were observed in both gold and silver after prolonged firing andor at excessively high temperatures. This variation was consistent with the wetting and spreading results of E1527 glass on gold and silver presented in the last quarterly report. Chemical analyses of the commercial copper and silver inks are presented.

Descriptors:

• *Thick films
• *Thin films
• *Adhesion
• *Metallizing
• *Microstructure
• Sintering
• Bonding
• Layers
• Glass
• Copper
• Silver
• Gold
• Oxidation
• Glazes
• Chemical analysis

Subject Categories:

• Properties of Metals and Alloys

Distribution Statement:

APPROVED FOR PUBLIC RELEASE