Accession Number:

ADA017444

Title:

Thermal Resistance of Microelectronic Packages. Part 1. Recommended Method 1012 (Thermal Characteristics) for MIL-STD-883. Part 2. Summary of Analyses and Experimental Data for Thermal Test Packages and MIL-M-38510 Packages.

Descriptive Note:

Final rept. 15 Feb 74-14 Mar 75,

Corporate Author:

GENERAL ELECTRIC CO SYRACUSE N Y ELECTRONICS LAB

Report Date:

1975-08-01

Pagination or Media Count:

106.0

Abstract:

Methods for measurement of thermal resistance and response curves, including MIL-STD-883 Method 1012, were evaluated to determine an optimum method to measure MIL-M-38510 packages. Computer simulation, IR and electrical measurements were evaluated and compared for special thermal test packages. A ratio of about 51 was shown to exist for the junction peak, average and region temperature rise. Measurements can be misleading without proper interpretation. The optimum method, IR measurement of a coated chip, can measure only the junction region thermal resistance.

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE