Basic Adhesion Mechanisms in Thick and Thin Films.
Final rept. 1 Jan-31 Dec 74,
RCA LABS PRINCETON N J
Pagination or Media Count:
Seventeen commercial, gold-based thick-film conductor inks and four alumina substrates two each, 96 and 99.5 wt pct were characterized physically and chemically. These characterizations were performed on as-received materials. Films were screen-printed and singly fired and refired 5 times in accordance with manufacturer recommendations commensurate with thick-film hybrid microelectronic usage adhesion strength, conductivity, and other properties of the films were measured and are reported.
- Electrical and Electronic Equipment