Accession Number:

ADA011906

Title:

Basic Adhesion Mechanisms in Thick and Thin Films.

Descriptive Note:

Final rept. 1 Jan-31 Dec 74,

Corporate Author:

RCA LABS PRINCETON N J

Personal Author(s):

Report Date:

1975-01-31

Pagination or Media Count:

227.0

Abstract:

Seventeen commercial, gold-based thick-film conductor inks and four alumina substrates two each, 96 and 99.5 wt pct were characterized physically and chemically. These characterizations were performed on as-received materials. Films were screen-printed and singly fired and refired 5 times in accordance with manufacturer recommendations commensurate with thick-film hybrid microelectronic usage adhesion strength, conductivity, and other properties of the films were measured and are reported.

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE