Accession Number:

ADA010782

Title:

Hardened Hybrid Semiconductor Packages. Task II.

Descriptive Note:

Final rept. 1 Jan-31 Jan 75,

Corporate Author:

WESTINGHOUSE DEFENSE AND ELECTRONIC SYSTEMS CENTER BALTIMORE MD SYSTEMS DEVELOPMENT DIV

Personal Author(s):

• Lindberg,Frank A.

Report Date:

1975-05-01

Pagination or Media Count:

27.0

Abstract:

The work was performed to develop a radiation hardened packaging technique for packaging a whole round semiconductor wafer. The metal which connected the wafer bonding pads to the package output pins was aluminum which was vapor deposited through a mask on the inside surface of the package. One end of each conductor line was lifted off the package surface to form a beam lead. These beam leads were then ultrasonically bonded to the wafer bonding pads.

Descriptors:

• *SEMICONDUCTOR DEVICES
• *RADIATION HARDENING
• VAPOR DEPOSITION
• VACUUM APPARATUS
• CIRCUIT INTERCONNECTIONS
• PACKAGING
• ULTRASONIC WELDING

Subject Categories:

• Electrical and Electronic Equipment
• Manufacturing and Industrial Engineering and Control of Production Systems

Distribution Statement:

APPROVED FOR PUBLIC RELEASE