Accession Number:

ADA009098

Title:

Materials Bonding.

Descriptive Note:

Final rept.,

Corporate Author:

DEBELL AND RICHARDSON INC ENFIELD CONN

Personal Author(s):

Report Date:

1975-04-30

Pagination or Media Count:

46.0

Abstract:

A molding compound based on Ethylene Propylene Diene Rubber EPDM was developed and tested for use as a tie material in underwater cable and connector splicing. The development of a tie material permits the use of wire and cable with a range of insulating materials in an underwater cable system, and the restoration of insulation at splices and connectors by molding. The report covers the requirements of a tie material and the formulation, and physical and electrical properties of the compound developed. Use of the compound with polyethylene, polypropylene, and neoprene insulations as well as connector materials such as stainless steel, monel, and beryllium copper is discussed. For each of the above materials, methods of surface preparation andor treatment prior to molding are given. Molding systems and cycle parameters are outlined.

Subject Categories:

  • Electrical and Electronic Equipment
  • Adhesives, Seals and Binders
  • Elastomers and Rubber

Distribution Statement:

APPROVED FOR PUBLIC RELEASE