Accession Number:

ADA007001

Title:

Failures of Aluminum Metalizations on Silicon Integrated Circuits,

Descriptive Note:

Corporate Author:

IIT RESEARCH INST CHICAGO ILL RELIABILITY ANALYSIS CENTER

Personal Author(s):

Report Date:

1968-07-01

Pagination or Media Count:

34.0

Abstract:

The monograph discusses the failure of aluminum interconnecting metalization patterns used on silicon integrated circuits. The primary subject area is limited to those failures occurring in the metalized aluminum interconnecting stripes independent of their terminating interfaces. The subject is covered by first describing metalization failures at a gross level in terms of the function of the metalization and the manners in which it can fail, the means of detecting these failures, and the use of failure analysis techniques to determine the failure cause and phenomena. Section III describes the failure phenomena pertinent to metalization. A bibliography of references on metalization failures concludes the report.

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE