Accession Number:

ADA007000

Title:

Face Down (Flip Chip) Microcircuit Bonding Systems,

Descriptive Note:

Corporate Author:

IIT RESEARCH INST CHICAGO ILL RELIABILITY ANALYSIS CENTER

Personal Author(s):

Report Date:

1968-07-01

Pagination or Media Count:

55.0

Abstract:

The purpose of the monograph is to present an overview of the state-of-the-art of flip-chip die bonding. Following the summary in the next section, a description of the basic technology of flip-chip die bonding is given. Discussions of substrates, metallurgy systems, flip-chip assembly, and environmental protection and external leads follow. These sections are then brought into perspective by a discussion of complete flip-chip systems and reliability. The final section reviews current developmental activities of major integrated circuit manufacturers.

Subject Categories:

  • Electrical and Electronic Equipment
  • Manufacturing and Industrial Engineering and Control of Production Systems

Distribution Statement:

APPROVED FOR PUBLIC RELEASE