Face Down (Flip Chip) Microcircuit Bonding Systems,
IIT RESEARCH INST CHICAGO ILL RELIABILITY ANALYSIS CENTER
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The purpose of the monograph is to present an overview of the state-of-the-art of flip-chip die bonding. Following the summary in the next section, a description of the basic technology of flip-chip die bonding is given. Discussions of substrates, metallurgy systems, flip-chip assembly, and environmental protection and external leads follow. These sections are then brought into perspective by a discussion of complete flip-chip systems and reliability. The final section reviews current developmental activities of major integrated circuit manufacturers.
- Electrical and Electronic Equipment
- Manufacturing and Industrial Engineering and Control of Production Systems