Reliability Study of Microwave Transistor Packaging.
Interim rept. Jan-Aug 74,
GENERAL ELECTRIC CO SYRACUSE N Y ELECTRONICS LAB
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The report presents the results of the first seven months of effort on a program to evaluate the influence of the package on the reliability of microwave power transistors. Emphasis in this study is placed on the effect of the package on the device reliability and not on the package itself. Several different aspects of the problem are being studied simultaneously. They include stress tests on available modules determining the effect of wire movement on the device performance and determining the influence of the external circuit impedance on junction temperature and device performance. In addition, a vendor survey has been carried out and available carriers are being characterized to determine design integrity and quality of construction.
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