Accession Number:

AD1166889

Title:

Integrated Quantum Photonics for Photon-Ion Entanglement

Descriptive Note:

[Technical Report, Final Report]

Corporate Author:

Rochester Institute of Technology

Personal Author(s):

• Preble, Stefan F.

Report Date:

2022-04-01

Pagination or Media Count:

44

Abstract:

This project focused on the realization of an integrated platform for quantum photonics. Photonic Integrated Circuit PIC technologies enable the integration of all the components of a quantum photonic system photon sources, interferometers for manipulating the photon state onto a high density, phase stable, high efficiency, and high-performance Silicon substrate. However, traditional PIC fabrication has been optimized for classical applications where loss and crosstalk are not as important. In this project we worked with AFRL and AIM Photonics to successfully realize a foundry quantum integrated platform, along with the key device and circuit level building blocks photon sources, low loss waveguides, interferometers, phase shifters. We also demonstrated robust optical and electrical packaging that enables the chips to be interfaced with optical fiber networks and electrical hardware.

Descriptors:

Subject Categories:

• Optics
• Quantum Theory and Relativity
• Electrical and Electronic Equipment

Distribution Statement:

[A, Approved For Public Release]