Accession Number:

AD1158236

Title:

Enhancing Thermal Transport at Solid-Solid Interfaces

Descriptive Note:

[Technical Report, Final Report]

Corporate Author:

CORNELL UNIV ITHACA NY

Personal Author(s):

Report Date:

2022-01-28

Pagination or Media Count:

8

Abstract:

The objective of this proposal is to significantly advance the fundamental knowledge of interfacial thermal transport, enabling the rational design of thermal interfaces with ultralow thermal interface resistance for efficient cooling of electronics. The specific objectives are 1. Formulate acomprehensive atomistic Greens function AGF model Detailed information of interface transmittance can unveil the underlying processes that occur at interfaces, which, together with phonon transport processes in bulk materials, will complete the picture of phonon transport. 2. Develop a new measurement approach To validate the simulation results, we will introduce a new technique for interfacial thermal measurement -- transient thermal grating TTG spectroscopy, which probes thermal transport at the interfaces with high sensitivity.

Descriptors:

Subject Categories:

  • Solid State Physics
  • Thermodynamics

Distribution Statement:

[A, Approved For Public Release]