Enhancing Thermal Transport at Solid-Solid Interfaces
[Technical Report, Final Report]
CORNELL UNIV ITHACA NY
Pagination or Media Count:
The objective of this proposal is to significantly advance the fundamental knowledge of interfacial thermal transport, enabling the rational design of thermal interfaces with ultralow thermal interface resistance for efficient cooling of electronics. The specific objectives are 1. Formulate acomprehensive atomistic Greens function AGF model Detailed information of interface transmittance can unveil the underlying processes that occur at interfaces, which, together with phonon transport processes in bulk materials, will complete the picture of phonon transport. 2. Develop a new measurement approach To validate the simulation results, we will introduce a new technique for interfacial thermal measurement -- transient thermal grating TTG spectroscopy, which probes thermal transport at the interfaces with high sensitivity.
- Solid State Physics