Accession Number:

AD1107009

Title:

2.5D and 3D FPGA-Centric Microfluidic Cooling Architectural Platforms for Superior Computational Throughput

Descriptive Note:

Technical Report,28 Jul 2016,27 Nov 2019

Corporate Author:

GEORGIA INST OF TECH ATLANTA ATLANTA United States

Report Date:

2019-11-27

Pagination or Media Count:

48.0

Abstract:

During this program, Georgia Tech developed highly integrated microfluidic cooling technologies for 2.5D high-power density and high-performance electronics. Multiple fabrication technologies were developed and demonstrated. Lateral manifolds using 3D printing to enable ultra-compact inletoutlet manifolds were also developed. Using a Stratix 10 FPGA as a platform, our proposed thermal technologies reduced the junction temperature of the FPGA by more than 32C when compared to air cooling. Moreover when compared to air cooling, the thermal coupling of the FPGA on the surrounding transceiver die temperatures was reduced by a factor of 10x to over 100x.

Subject Categories:

  • Electrooptical and Optoelectronic Devices
  • Fluidics and Fluerics
  • Air Conditioning, Heating, Lighting and Ventilating
  • Computer Hardware

Distribution Statement:

APPROVED FOR PUBLIC RELEASE