Accession Number:

AD1092355

Title:

3D Integrated Superconducting Qubits

Descriptive Note:

Journal Article - Open Access

Corporate Author:

MIT Lincoln Laboratory Lexington United States

Report Date:

2017-10-09

Pagination or Media Count:

5.0

Abstract:

As the field of quantum computing advances from the few-qubit stage to larger-scale processors, qubit addressability and extensibility will necessitate the use of 3D integration and packaging. While 3D integration is well-developed for commercial electronics, relatively little work has been performed to determine its compatibility with high-coherence solid-state qubits. Of particular concern, qubit coherence times can be suppressed by the requisite processing steps and close proximity of another chip. In this work, we use a flip-chip process to bond a chip with superconducting flux qubits to another chip containing structures for qubit readout and control.

Subject Categories:

  • Quantum Theory and Relativity

Distribution Statement:

APPROVED FOR PUBLIC RELEASE