A New Procedure for the Application and Curing of Polyimide Film on Gold Coated Silicon Wafers
Technical Report,01 May 2008,30 Nov 2008
U.S. Army Research Laboratory Adelphi United States
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A new repeatable process was developed for fabricating a polyimide-coated silicon wafer patterned with gold grating lines on the polyimide surface. A silicon wafer was first metalized with gold, followed by a cured polyimide layer, and the resulting polyimide layer was then patterned on the surface with gold grating lines. The project required the polyimide layer to be a uniform thickness across a 2-in silicon wafer. The polyimide coating needed to adhere to the gold undercoating and needed to be patterned with very narrow on the order of 1.5 microns repeating gold lines.
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