Accession Number:

AD1090494

Title:

A New Procedure for the Application and Curing of Polyimide Film on Gold Coated Silicon Wafers

Descriptive Note:

Technical Report,01 May 2008,30 Nov 2008

Corporate Author:

U.S. Army Research Laboratory Adelphi United States

Personal Author(s):

Report Date:

2009-11-01

Pagination or Media Count:

16.0

Abstract:

A new repeatable process was developed for fabricating a polyimide-coated silicon wafer patterned with gold grating lines on the polyimide surface. A silicon wafer was first metalized with gold, followed by a cured polyimide layer, and the resulting polyimide layer was then patterned on the surface with gold grating lines. The project required the polyimide layer to be a uniform thickness across a 2-in silicon wafer. The polyimide coating needed to adhere to the gold undercoating and needed to be patterned with very narrow on the order of 1.5 microns repeating gold lines.

Subject Categories:

  • Coatings, Colorants and Finishes

Distribution Statement:

APPROVED FOR PUBLIC RELEASE