Accession Number:

AD1089116

Title:

Smart PCB Digital Factory Technical Publication

Descriptive Note:

[Technical Report, Final Report]

Corporate Author:

LOCKHEED MARTIN CORP LITTLETON CO

Personal Author(s):

• Doner, Deanna

Report Date:

2018-06-16

Pagination or Media Count:

131

Abstract:

Electronic computer-aided design ECAD software used to design printed circuit boards PCBs continues to evolve and PCB manufacturing processes continue to advance, but the transfer of data between PCB designers and manufacturers has changed very little in the last 15 years. PCB build data today is comprised of a combination of electronic and paper documents spread across many files and multiple formats, i.e. PDF, HPGL, JPEG, STEP, IGES, Excellon, ODB, ASCII, Gerber RS-274X, IPC-D-356, etc.. This shopping cart of files, is unintelligently linked making data transfer and more importantly design intent difficult to communicate and interpret. As a result, todays PCB manufacturers must review, translate andor re-enter the data, causing their manufacturing processes to be labor intensive and prone to error. The Smart PCB Digital Factory, sponsored by the Digital Manufacturing and Design Innovation Institute DMDII, set out to eliminate the multiple file formats and the error-prone manual intervention required today by demonstrating that a single data file, IPC-2581 Rev B or IPC-2581B, containing the ECAD, Mechanical Computer-Aided Design MCAD and Bill of Materials BOM information could be successfully used to manufacture a PCB from design through fabrication, assembly and test.

Descriptors:

• digital data
• application software
• circuit boards
• computer programming
• computers
• manufacturing
• printed circuits
• data set
• electronic components
• fabrication
• printed circuit boards
• test equipment
• computer-aided design
• failure mode and effect analysis
• product development
• engineering
• accuracy
• assembly
• automation
• databases

Subject Categories:

• Computer Hardware
• Electrical and Electronic Equipment

Distribution Statement:

[A, Approved For Public Release]