Accession Number:

AD1082999

Title:

Wafer Bonding for Hybrid Photonic Integration Research

Descriptive Note:

Technical Report,15 Jul 2017,14 Jan 2019

Corporate Author:

Clemson University Clemson U United States

Personal Author(s):

Report Date:

2019-04-22

Pagination or Media Count:

9.0

Abstract:

The primary objective of this proposal is to create the wafer bonding capability at Clemson University to support several ongoing photonic integration related projects supported by the DoD. This new capability will also enable many other research projects in photonics and electronics and greatly enhance research-orientated education of undergraduate and graduate students.

Subject Categories:

  • Electrical and Electronic Equipment
  • Fiber Optics and Integrated Optics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE