Wafer Bonding for Hybrid Photonic Integration Research
Technical Report,15 Jul 2017,14 Jan 2019
Clemson University Clemson U United States
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The primary objective of this proposal is to create the wafer bonding capability at Clemson University to support several ongoing photonic integration related projects supported by the DoD. This new capability will also enable many other research projects in photonics and electronics and greatly enhance research-orientated education of undergraduate and graduate students.
- Electrical and Electronic Equipment
- Fiber Optics and Integrated Optics