Accession Number:

AD1071154

Title:

Integration of Three-Dimensional Silicon Microtip Arrays onto Flexible Substrate

Descriptive Note:

Technical Report,27 Sep 2016,26 Sep 2017

Corporate Author:

Purdue University West Lafayette United States

Personal Author(s):

Report Date:

2018-10-25

Pagination or Media Count:

10.0

Abstract:

Vertically ordered Si nanotips, due to their nanoscale dimension and low cytoxicity, serve as an ideal platform for minimally invasive penetration into biological cells for the measurement of important electronical andor mechanical properties at the nanoscale. Currently available Si nanotip arrays are necessarily built on wafer-based substrates due to the requirement of compatibility with existing fabrication processes, leading to nonconformal interface between cells and Si nanotips. Here, we develop a novel fabrication method that enables the heterogeneous integration of vertically ordered Si nanotips with various kinds of mechanically flexible bio-related substrates.

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE