Accession Number:
AD1052611
Title:
Heterogeneous Multi-Die High-Density Interconnect Stitching
Descriptive Note:
Conference Paper
Corporate Author:
Georgia Institute of Technology Atlanta United States
Personal Author(s):
Report Date:
2018-03-12
Pagination or Media Count:
4.0
Abstract:
A high-density and a highly scalable heterogeneous multi-die integration technology is presented in this paper. Central to this approach is the dense integration ofheterogeneous ICs enabled by fine-pitch Compressible MicroInterconnects CMIs and stitch chips, which serve as the interface through which communication between active ICs occurs. A testbed is fabricated in order to characterize and demonstrate the proposed integration technology concatenated assembly of chips using the stitch chips with fine-pitch CMIs inline pitch of 20 microns. Electrical characterization, including resistance and S-parameters, of the interconnects are reported as well as the assembly of testbeds. The measured results show robust and low-loss interconnections across multi-chips
Descriptors:
Subject Categories:
- Electrical and Electronic Equipment
- Manufacturing and Industrial Engineering and Control of Production Systems