Accession Number:

AD1052611

Title:

Heterogeneous Multi-Die High-Density Interconnect Stitching

Descriptive Note:

Conference Paper

Corporate Author:

Georgia Institute of Technology Atlanta United States

Report Date:

2018-03-12

Pagination or Media Count:

4.0

Abstract:

A high-density and a highly scalable heterogeneous multi-die integration technology is presented in this paper. Central to this approach is the dense integration ofheterogeneous ICs enabled by fine-pitch Compressible MicroInterconnects CMIs and stitch chips, which serve as the interface through which communication between active ICs occurs. A testbed is fabricated in order to characterize and demonstrate the proposed integration technology concatenated assembly of chips using the stitch chips with fine-pitch CMIs inline pitch of 20 microns. Electrical characterization, including resistance and S-parameters, of the interconnects are reported as well as the assembly of testbeds. The measured results show robust and low-loss interconnections across multi-chips

Subject Categories:

  • Electrical and Electronic Equipment
  • Manufacturing and Industrial Engineering and Control of Production Systems

Distribution Statement:

APPROVED FOR PUBLIC RELEASE