Accession Number:

AD1041663

Title:

Novel Ruggedized Packaging Technology for VCSELs

Descriptive Note:

Conference Paper

Corporate Author:

Ultra Communications, Inc. Vista United States

Personal Author(s):

Report Date:

2017-03-01

Pagination or Media Count:

3.0

Abstract:

We describe chip-scale packaging CSP technology for compact, low-cost optical transceivers that contain OTDR technology. CSP creates board-level solder interconnect at the wafer level, eliminating the cost and parasitics associated with packages. OTDR technology enables insitu monitoring of fiber links.

Subject Categories:

Distribution Statement:

APPROVED FOR PUBLIC RELEASE