Thermally Optimized Paradigm of Thermal Management (TOP-M)
Technical Report,01 Jul 2015,01 Jul 2017
Technion R and D Foundation Ltd. Haifa Israel
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The main goal of this research was to present a New Thermal Management Approach, which combines thermally aware VeryUltra Large Scale Integration VLSIULSI architecture design with liquid cooling design from the very early step of the demonstrator System on Chip SoC design. Thermal sensors, which were integrated on several parts of the SoC, measured the on-line the local temperature, thus enabling better operation of the SoC as well as better control over the liquid cooling by providing on-line feedback. Complementary Metal Oxide Semiconductor CMOS Single Photon Avalanche Diode SPAD image sensors were used to demonstrate the new thermal management approach.
- Electrical and Electronic Equipment