Accession Number:

AD1038321

Title:

Thermally Optimized Paradigm of Thermal Management (TOP-M)

Descriptive Note:

Technical Report,01 Jul 2015,01 Jul 2017

Corporate Author:

Technion R and D Foundation Ltd. Haifa Israel

Personal Author(s):

• Nemirovsky, Yael
• Ginosar,Ran
• Malitis,Maria

Report Date:

2017-07-18

Pagination or Media Count:

34.0

Abstract:

The main goal of this research was to present a New Thermal Management Approach, which combines thermally aware VeryUltra Large Scale Integration VLSIULSI architecture design with liquid cooling design from the very early step of the demonstrator System on Chip SoC design. Thermal sensors, which were integrated on several parts of the SoC, measured the on-line the local temperature, thus enabling better operation of the SoC as well as better control over the liquid cooling by providing on-line feedback. Complementary Metal Oxide Semiconductor CMOS Single Photon Avalanche Diode SPAD image sensors were used to demonstrate the new thermal management approach.

Descriptors:

• complementary metal oxide semiconductors
• temperature control
• energy consumption
• liquid cooling
• fabrication
• temperature coefficients
• soft lithography
• manufacturing
• large scale integration
• circuits
• charge carriers
• calibration
• Avalanche DiodeS
• PHOTONS
• SYSTEM ON CHIP

Subject Categories:

• Electrical and Electronic Equipment
• Thermodynamics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE