Accession Number:
AD1025053
Title:
Moving Beyond 3D Hetero-Integration and Towards Monolithic Integration of Phase-Change RF Switches with SiGe BiCMOS
Descriptive Note:
Conference Paper
Corporate Author:
Northrop Grumman Corporation Linthicum United States
Personal Author(s):
Report Date:
2016-03-31
Pagination or Media Count:
3.0
Abstract:
A chip-scale, highly-reconfigurable transmitter and receiver, which hetero-integrates Northrop Grummans novel phase-change switch PCS technology with commercial SiGe BiCMOS using 3D stacking has been demonstrated. Further miniaturization and performance improvements are being pursued through fully monolithic integration. The current state of the technology will be discussed followed by a discussion of the advantages, goals and challenges of fully monolithic integration.
Descriptors:
Subject Categories:
- Electrical and Electronic Equipment
- Solid State Physics