Accession Number:

AD1024236

Title:

Tin Whisker Testing and Modeling

Descriptive Note:

Technical Report,01 Jan 2012,01 Oct 2015

Corporate Author:

BAE Systems Controls Endicott United States

Report Date:

2015-11-01

Pagination or Media Count:

305.0

Abstract:

Driven by legislation resulting from two European Union directives, Reduction of Hazardous Substances RoHS and Waste Electrical and Electronic Equipment Regulation WEEE, most commercial electronics manufacturers began delivering lead-free electronic components, assemblies, and equipment beginning in 2006. The DoD must now include lead-free materials considerations in the evaluation of commercial-off-the-shelf parts and assemblies intended for use in DoD systems. In particular, lead-free tin rich finishes and solder alloys are susceptible to tin whisker growth that can cause electrical short circuits and reduced reliability. This report describes the multi-year testing and modeling program to analyze tin whisker growth on lead-free manufactured assemblies and utilizes whisker short circuit statistical modeling to enable improved reliability assessments.

Subject Categories:

  • Electrical and Electronic Equipment
  • Fabrication Metallurgy

Distribution Statement:

APPROVED FOR PUBLIC RELEASE