A Designer Fluid For Aluminum Phase Change Devices. Performance Enhancement in Copper Heat Pipes Performance Enhancement in Copper Heat Pipes. Volume 3
Technical Report,29 Jun 2015,29 Sep 2016
University of California, Los Angeles Los Angeles United States
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The deposition mechanisms and dry-out dynamics of a designer fluid were investigated experimentally in a flat grooved heat pipe. Generated coatings were observed during heat pipe operation. The fluid deposits demonstrated enhanced liquid spreading. The coating was found to creep up onto the fin tops and increase evaporative surface area. The overall thermal resistance was lowered and the maximum heat transport was increased. A numerical heat pipe model was developed for a grooved wick. Measurements of the coating geometry on coverage were used as empirical closure to represent the designer fluid. The theoretical and experimental temperature distributions matched well. Uncertainties in the closure properties were the major source oferror.