Accession Number:

AD1023960

Title:

Method for Designing Electronic Assemblies without Potting for Gun Launched Applications Through the Use of Additive Manufacturing

Descriptive Note:

Technical Report,01 May 2013,30 Jun 2015

Corporate Author:

ARDEC, METC, MEF-E Picatinny Arsenal United States

Personal Author(s):

• Manole,Steven
• Stout,Christopher
• Baldwin,Nickolas
• Granitzki,Richard
• Caplinger,James
• Weinhold,Douglas
• Rotundo,Alfred

Report Date:

2016-12-01

Pagination or Media Count:

38.0

Abstract:

A method of using additive manufacturing to print conformal structural supports for printed circuit boards has been shown to be a viable method for ensuring the high G survivability of such electronics in gun launch applications. A novel design, analysis and testing approach has been shown to be successfully demonstrated.

Descriptors:

• additive manufacturing
• printed circuit boards
• precision guided munitions
• electronic components
• gun launched
• SPACERS

Subject Categories:

• Electrical and Electronic Equipment
• Printing and Graphic Arts

Distribution Statement:

APPROVED FOR PUBLIC RELEASE